Electronics Forum | Wed Jul 14 12:03:53 EDT 1999 | greg c.
i have worked with the universal gsm in the past and am now helping out a contracting company who is setting up one in their facility. My question is: the power requirments for the machine calls for 3-phase 230V, does it really need 230V or is the s
Electronics Forum | Wed Nov 11 23:45:53 EST 1998 | Mark D.
What are the factors that go into determining PCB Board temperature requirements for the Wavesolder process? Most of the recipes I've seen call for preheating the PCB to around 230F - 250F. This temp is about 210F - 230F below the typical solder temp
Electronics Forum | Fri Oct 06 08:21:26 EDT 2006 | inds
Mario, what happens when there are components on the boards that are not rated to take temperature of 230-240 C Peak for a mixed assembly. I guess there are tons of sn/Pb components that have rated temp of 225-230 C.. So in guess you might want
Electronics Forum | Wed Mar 12 15:26:46 EDT 2014 | dan_ems
Hello, in my SMT process I have some problems with the solderability (look like dewetting) on a PCB with finish HASL Lead Free with a composition that is melt at 230 degree Celsius. My oven is with vapor phase and the peak temperature is 230 degre
Electronics Forum | Thu Dec 28 13:11:37 EST 2000 | RONALD MALICK
I AM LOOKING FOR A COMPANY TO DO SOME GOLD TAB CLEAN UP -- REMOVE SOLDER SPLASH. ANY SUGGESTIONS?
Electronics Forum | Fri Jun 06 10:47:27 EDT 2003 | Marc Peo
Kevin, Agree with John's thoughts on profiling and the max temp of 240 degrees in particular. To add to it a bit we have seen the following parameters put in place at many assembly houses to protect against overcooking the components: --Time above
Electronics Forum | Tue Oct 28 09:24:10 EST 2003 | davef
Running a soldered BGA through a wave solder pot is very risky: * 230-240*C temperature of the pot could damage the device. * Solder in the pot will certainly cause bridging between BGA solder balls. * Solder in the pot could melt BGA solder balls.
Electronics Forum | Mon Jun 14 17:21:31 EDT 2004 | russ
How old are these parts? Sn/Ni plating is very succeptable to age and everything else. They are possibly tarnished. Also, what is your peak temp in reflow? It takes about 225 230 C to get good wetting to the underlying nickel. Russ
Electronics Forum | Sat Feb 26 01:11:26 EST 2005 | Grant
Hi, I was interested in your topic as well, and did a Google search on it. Found these and they look interesting. http://www.metro.com/commercial/products_detail.cfm/section/1/subsection/29/category/48/subcategory/230/group/0/product/481 Regards,
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
