Electronics Forum: 25c (Page 2 of 5)

Reflow PBGA

Electronics Forum | Wed Jun 26 12:18:40 EDT 2002 | dason_c

Steve, I suggest to review some of the paste handlering procedure from some of the supplier. Aim look have a better procedure for our industrial but you need to check with your paste requriement. ie. Indium can store the paste @25C for 3 mths??? h

Tombstone defect

Electronics Forum | Tue Jun 03 21:50:57 EDT 2003 | yukim

A question regarding the rampup slop: as we cannot make the preheat time long enough due to our reflow oven limits, a Loctite technician suggested we increase the rampup slope, between the initial point (25C) and 80C, to 4C/sec, as between these temp

Thermal Profiler Shield

Electronics Forum | Thu Jun 01 10:08:59 EDT 2006 | ratsalad

I sewed a sock out of a Nomex/Kevlar blend fabric because we had the same problem with our profiler. It works great. After one run through the reflow oven, the internal temp rises by about 5 degrees C. It used to go up by about 20-25 C. I can pic

5% color spot in HIC

Electronics Forum | Tue Jul 17 00:10:32 EDT 2012 | amitsindwani

Referring to IPC/JEDEC J-STD-033B.1 section 3.3.2.2 'The amount of desiccant used, per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB to less than 10% at 25°C.' So wha

Humidity & Temperature Range on SMT SHopfloor

Electronics Forum | Mon Aug 26 12:37:58 EDT 2013 | deanm

Your stencil printing process is probably the most critical process in SMT. The paste I'm using states the best environment is with a temperature of 20-25C and humidity of 35-60% RH. Your paste may vary. We've run down to 10-15% RH with no measurable

Moisture Attraction Inside Moisture Barrier Bag

Electronics Forum | Mon Jul 12 20:26:10 EDT 2021 | stephendo

A test that I would like to see is, expose parts for 24 hours 40%-60% RH, 25C for 24 hours. Then seal with a HIC and minimum desiccant that Jstd 33 requires. Five to seven days later open and see if HIC says good but parts have excess moisture. I t

Re: Temperature & Humidity Effects on Solder Paste

Electronics Forum | Sat Aug 01 09:19:59 EDT 1998 | Claudio Carnevali

I can explain my experience. I had a no clean paste and in summer I had a lot of problems. Now I have installed and air cooling system and I work with 25�C and 50-55%. I think you'll have less problems but smt problems usually doesn't have only one a

Solder balls

Electronics Forum | Thu Jun 24 23:00:36 EDT 2004 | yukim

Tried with several lots of solder paste, manufactured in Feb and March this year. Work ambient: 25C, 60~70%. Is this humidity too much? I'll reduce the ramp in our profile. One change: We changed the conveyor motor in our reflow oven just before the

Ionic - MIL-P-28809A vs IPC TM650 (2.3.25C)

Electronics Forum | Wed Nov 19 06:02:22 EST 2008 | caerleon

Hi all, I have been in the game for near on 15 years and finally something has stumped me! As this site has always provided a wealth of knowledge and at times some amusement I have decided to post it here. Ok. My company uses a test method on an Om

Help TQFP welding problem

Electronics Forum | Tue Apr 20 12:28:46 EDT 2021 | kylehunter

I agree with DWL's comments. Also, your profile is really really inconsistent. How did you attach the probes to the board? You have a 25c delta in your peak temps. Unless that is from a probe lifting, that is really bad. What type of oven are you usi


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