Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc
When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A
Electronics Forum | Thu Jun 19 10:47:29 EDT 2003 | Eric QE
Caltex or Ersa type system is good, Caltex prisms, necessary for looking underneath the BGA can be crashed easily when looking under low profile or Micros. $40-$110 each depending on the availability and who makes 'em. We have 2D and 3D X-ray avai
Electronics Forum | Mon Jul 01 13:19:55 EDT 2013 | emeto
I always look for a toe fillet if the design allows you to. Many times the pad design is close or exactly the size of the leads which makes people to touch it up right away. I told them hundred times not to but...Luckily I have 3D x-ray and I can tel
Electronics Forum | Mon Jan 18 19:48:03 EST 2010 | glennster
Hi, At Process Sciences we can provide high-res X-ray inspection. You can view some sample images on our website. Glenn Robertson www.process-sciences.com
Electronics Forum | Tue Jan 26 12:29:09 EST 2010 | blnorman
A few years ago we sent some samples to Dage for them to analyze on one of their 3D systems.
Electronics Forum | Tue Jan 26 18:23:33 EST 2010 | glennster
I agree that Dage makes some excellent 3D (CAT) systems, but in our experience a high-resolution 2D system with tilt capability is usually better-suited for inspection of solder joints. Glenn Robertson Process Sciences
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Fri Jul 21 12:15:52 EDT 2006 | CKH
Hi Folk, every now and then, i would encounter Functional Failure due to BGA ICs. The Testing Tech always conclude that the contact of the BGA to the PCB Pad is poor. The 2D/3D X-ray machine can't detect any of the poor contact on the BGA..... We
Electronics Forum | Thu Jan 31 15:13:20 EST 2008 | chef
You will need to develop your reflow profile which includes drilling a hole through the fab and into the ball for accurate temp measure. During profile/process development you will probably want 3D x-ray (consider contracting that out). Once in prod
Electronics Forum | Tue Jan 26 10:29:22 EST 2010 | devgru
You may want to contact YESTech (www.yestechinc.com) and see if they can help you out. If you are in the market to purchase, they have great systems. If you just need to look at a couple samples, they are pretty good about helping people out.
