Electronics Forum | Thu Apr 11 10:54:34 EDT 2019 | bmalhi
NITROGEN INLET: 2000 CFH ( 56.6 m 3/H R) MAX, 100 PSI (6.9 bar) MAX, 70 PSI (4.8 bar ) MIN For service inquires you can contact Heller by e-mail ServiceNJ@hellerindustries.com or call 973-377-6800 Ext. 5.
Electronics Forum | Tue May 08 12:57:30 EDT 2001 | Morris
I've seen these used & they work quite well. The fiberglass scratch brush. http://contacteast.com/product/prodpage.cfm?grp=4F7A9B48-C870-11D4-8A700050DA5FEB55&sid=FC52FB8C-A662-46E4-B3CBDAD625F7B085 You will want to train the operators to use some
Electronics Forum | Tue Apr 13 13:20:00 EDT 1999 | Hunter
Dear all, We are a newly constructed factory for Computer prehpirals assembly . We are looking for a company which can supply a complete BOMS for the following items. You can recommend the models as well - Mother Boards (with/without) SBlaster. - SD
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Wed Mar 24 20:10:06 EST 2004 | Ken
IF you open up your TV, cd player or color printer you will see RA / RMA flux ON EVERYTHING! The waxy binder protects the halogenated compounds from becoming active with atmospheric moisture. Self healing is a good way to look at it. However, OA is
Electronics Forum | Sun Apr 04 15:33:01 EDT 2004 | Jimmy
We are looking at several reflow ovens with intent to acquire one for both air and nitrogen reflow capability (i.e. have the capability to reflow in either air or nitrogen environment). Would be interested to know what I should look for in comparing
Electronics Forum | Mon May 21 09:06:33 EDT 2007 | davef
Pat: Very descriptive SUBJECT choice. Surface tension: * Soldering and Surface Tension; Champion, JA; Physics Education, V 16, No 2, 1981, pp 98-100(3) Institute of Physics [We have not looked at this, so we cannot comment, but it seems like an appr
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman
While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR
