Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Thu Apr 27 23:42:36 EDT 2006 | ajca20
Well the first thing you should know is once Mydata comes out with a new version, the older one is done. We have upgraded to the 2.4.4 and it it was well worth it. We increased our speed because the Agilis LM magazines are faster. Mydata always adds
Electronics Forum | Fri May 10 20:37:36 EDT 2013 | dman97
Does anyone have a copy of USOS 1.4.4 for the GSM1 machine? I have a vintage 1995 GSM machine that needs to have its software reinstalled but I dont have the floppy disks that came with the machine. If anyone can help please email me @ thunderkid_l
Electronics Forum | Fri Nov 20 01:00:50 EST 2015 | anilwagh
I am looking below parts of CP4-2. 1)1P150E-24-2 3)2MMB500U-01-1 3)3MMB50-4-1 4)4P300E-05-1 5)CACR-SR03BC IKS-Y264-1 6)CACR-SR10BC 1KS-Y262-1 7)CACR-SR44 BC 1BF-Y279-1
Electronics Forum | Mon Nov 20 19:49:03 EST 2006 | davef
Sorry for stating this incorrectly. It should been: Bow & twist for bare boards and panels: IPC-A-610 Acceptability of Electronic Assemblies, 10.6: 1.5% for PTH only and 0.75% for SMT, acording to test method TM-650, method 2.4.22 IPC-6012, par. 3.
Electronics Forum | Mon Jan 19 09:07:45 EST 2015 | cotinc01
We can offer several nozzles to assist with the placement of 0402/0201 components in the four-spindle head. We offer the 06MPF along with custom ceramic tipped nozzles. Most of our standard nozzles for this head type are less than $125.00 each. Chec
Electronics Forum | Fri Nov 02 08:30:40 EST 2001 | fmonette
For double-side reflow boards, take note that if you have moisture-sensitive components on the first side, you will need to track their remaining floor life up to the final reflow. This is because the reflow process is too fast to effectively remove
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to
Electronics Forum | Thu Aug 24 06:58:19 EDT 2006 | davef
Darby National published stencil recommendations for their LGA in the "SMT Assembly Recommendations" section of: http://www.national.com/an/AN/AN-1187.pdf Is it possible that Silicon Laboratories published a similar document for your Cygnal CP2101?
