Electronics Forum: 6092 (Page 2 of 4)

Tombstone defect

Electronics Forum | Mon May 05 09:53:13 EDT 2003 | k_h

Stencil thickness = 175 microns? If my math is correct, 175u=0.175mil, and if that is english units then it is inches. I'm not understanding this correctly, please clarify for my sake please, are you saying the stencil thickness is 0.000175 inches th

Tombstone defect

Electronics Forum | Mon May 05 12:16:07 EDT 2003 | russ

A micron is 1 millionth of a meter, this term is no longer used according to my dictionary. I would have to agree with the dictionary. Anyway, 175 microns is a little more than 6.8 mils. Russ

Tombstone defect

Electronics Forum | Tue May 06 05:02:42 EDT 2003 | Grant

Hi, Ok, thanks for the reply, and this is really interesting. I wonder if there are any good articles about this to read somewhere. Regards, Grant

Tombstone defect

Electronics Forum | Tue May 06 06:29:06 EDT 2003 | yukim

Hi, No, the layout is different, but both have chips located arallel and perpendicularly to the flow direction. And we do have defects in both orientation. What about the PCB warpage? Sometimes we find warped PCBs. Could this affect? Thanks, Yu.

Tombstone defect

Electronics Forum | Tue May 06 22:31:52 EDT 2003 | yukim

Yes, we did try: built a lot of 200 PCBs with Sn62Ag2 solder paste (we have been using Sn63) and it helped, but not eliminated the problem.

Tombstone defect

Electronics Forum | Wed May 07 11:32:54 EDT 2003 | Grant

Hi, What brand passive components would you recomend for best quality of construction. We are never sure what's good and what's now, and what at some of the better brands. Regards, Grant

Tombstone defect

Electronics Forum | Wed May 07 17:38:06 EDT 2003 | davef

We like the passive components that the buyer gets to the stock room in time to meet the build plan. It's a plus if they take solder.

Tombstone defect

Electronics Forum | Fri May 16 20:55:05 EDT 2003 | jonfox

The term is still valid and used everyday by those in the die placement and "micro"-electronics world. MILS is too hard to understand at that level. Its just easier to say 10 microns than 0.3937 mils.

Tombstone defect

Electronics Forum | Mon May 19 02:36:25 EDT 2003 | Thomas

Hi Grant, From what I know, it has something to do with the flux...Imagine if the temp difference of the flux is somehow slowed down..it would reduce the tendency of a stronger pull on one side of the pad...

Tombstone defect

Electronics Forum | Fri May 30 11:23:10 EDT 2003 | dsuraski

AIM has an article that includes anti-tombstoning solder paste information. It's called "Reducing The Tombstoning of Small Discrete Components" and is located at http://www.aimsolder.com/technical_articles.cfm#14 Or I can send a copy to anyone inte


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