Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef
Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar
Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?
Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003
Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's
Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling
CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function
Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef
Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu
