Electronics Forum | Thu Dec 18 09:30:39 EST 1997 | Mike Cox
Thanks for the help I have all the info I need Mike | | I need information on how to interpret the markings on ceramic chip caps. IE: a3 = .01uf etc. | | Any info on a source would be great | | Mike Cox | Check the supplier they should have laser ma
Electronics Forum | Tue Jun 08 18:25:47 EDT 2010 | smtmax
Hi Danny, Are you doing lead free? If yes, I would consider the AE-R330A or SMT-2010 lead free reflow oven. Our reflow oven is affordable and brand new. Just want to make sure what size is your board. Also, all of our equipment comes with one year s
Electronics Forum | Mon Mar 26 18:23:47 EDT 2012 | frcdave
Hello Sergio, I can provide you expert perspective on the VT-RNS-PT from Omron as well as on the YESTech platforms. The VT-RNS-PT product is super complicated and difficult to understand from a programming and operation standpoint and really does no
Electronics Forum | Tue May 28 18:23:15 EDT 2019 | slthomas
TDK makes the CGA series "soft termination" caps. The p/n we use is CGA3E3X7S1A225K080AE, which will get you in the ball park for datasheets. We have moved to this to counter some variability in a heat staking machine (that we have yet to work out
Electronics Forum | Fri Mar 03 16:11:07 EST 2000 | cpitarys
Yes it is Ok and some folks ae doing it now, but unfortunatly IPA may not be the best solvent for this application. Take a small vial of the ipa and put some of your smt adhesive into it, shake it up and watch what happens, now step this up onto a l
Electronics Forum | Fri Mar 03 16:11:07 EST 2000 | cpitarys
Yes it is Ok and some folks ae doing it now, but unfortunatly IPA may not be the best solvent for this application. Take a small vial of the ipa and put some of your smt adhesive into it, shake it up and watch what happens, now step this up onto a l
Electronics Forum | Sat Oct 06 08:36:04 EDT 2001 | davef
Your point about thermosets getting soft in the preheater of the wave is well taken. But an adhesive that is used past its expiry or other up-front lack of process control represent 99 & 44/100 percent of the reason for �glued parts falling off in
Electronics Forum | Wed Jun 26 10:36:24 EDT 2002 | Steve L
Thanks for all of your valuable inputs. The paste we are useing is PWS0111Ae36 (Alpha MEtal), peak temp from 210 to 225 C. The paste was on the floor about 3 weeks. ianchan, when you mentioned "no more than 6 hrs in the stencil", you mean no more t
Electronics Forum | Mon Sep 17 03:59:52 EDT 2012 | stivais
Hi guys, We have an interesting case we haven't seen before (see the picture below) http://postimage.org/image/lu2f4ae55/ Solder balls form on unpopulated pads after reflow. 1. Reflow profile is fine. 2. Stencil thickness / paste volume is also f
Electronics Forum | Tue Mar 05 11:07:17 EST 2019 | sumote
Looking to purchase a DIP lead forming tool. The tool that has the 2 rollers that let you place the DIP part on the rail and run it between 2 rollers (ball-bearing?). I found a place that once sold them. They were called an RS Pro IC Insertion Tool
