Electronics Forum | Thu Apr 16 11:58:20 EDT 2009 | ccross
We have seen this exact same problem. Our vendor agreed it was their problem and also agreed it was a moisture issue within the PCB layers, not the solder mask. We have taken to baking our boards, especially when they are manufactured during the late
Electronics Forum | Thu Jan 29 15:36:33 EST 2015 | cyber_wolf
I might agree with the type that is fused to the stencil. I do not agree with buffing on the stuff on that smells exactly like rain-X. There is just not enough data.
Electronics Forum | Wed Jul 12 21:35:56 EDT 2000 | Dave F
John: I agree. We keep out lead stand-off below 60 thou.
Electronics Forum | Thu Jul 06 20:10:06 EDT 2000 | Dave F
I agree. Make them quit doing this ugly thing to your boards!!!
Electronics Forum | Tue Jun 06 20:02:55 EDT 2000 | Dave F
Ravi: I agree with travis. What's the issue?
Electronics Forum | Tue Apr 11 20:39:27 EDT 2000 | Dave F
Ashok: I agree with John. This is not normal. Dave F
Electronics Forum | Mon Oct 01 16:55:27 EDT 2001 | davef
I agree. Poor soldering technique is the most straightward way of creating solder balls during hand soldering operations.
Electronics Forum | Fri Nov 02 20:15:13 EST 2001 | caldon
Ahhhh America.... It is great to agree to disagree.
Electronics Forum | Mon Nov 26 17:42:24 EST 2001 | davef
I agree. Voids in plating are bad news and baking will not change that.
Electronics Forum | Wed Jan 16 17:42:33 EST 2002 | Terrapin
The standard - not agreed on by all - is IPC-9850. This has been adopted by most major players
