Electronics Forum: alpha and metals (Page 2 of 30)

Wave process w/Alpha Metal 310M

Electronics Forum | Mon Oct 18 17:49:27 EDT 1999 | NickMata

I am in need of information relating to wave process using Alpha Metal 310M. Residue on product, its impact on the testing process? SIR testing, data results. Has anyone washed / not washed while using this flux? Differences in results. Thanks in

Lead Free and ICT

Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry

Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng

Wave flux and profiling

Electronics Forum | Tue Dec 19 16:26:24 EST 2006 | samir

Grant, Newer lead-free fluxes have 6%-10% solids content - more activator, therefore leave more "visible" residues. Old technology tin-lead fluxes got down to as low as around the 4%-6% range (I'm going off memory, so me might be wrong)... You'll

Pad and Stencil Design

Electronics Forum | Sat Feb 09 17:33:30 EST 2002 | George Verboven

For more info about Metal Stencil Overview. also look at: http://www.tkb-4u.com/articles/printing/metalstenciloverview/metalstenciloverview.php

Granite Surface and ESD

Electronics Forum | Mon Mar 28 09:56:36 EST 2005 | n wolford

We have a granite table out on our production floor. We use the table along with metal parallel bars and a height gauge to measure component height. Some of these boards have components on them that may be ESD sensitive. Does anyone have experience w

Re: MoonMan and Tetras

Electronics Forum | Mon Apr 26 17:31:14 EDT 1999 | Earl Moon

| Hey MoonMan, | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop! "Foiled"

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

Granite Surface and ESD

Electronics Forum | Thu Mar 31 23:14:18 EST 2005 | Steve

Russ if your asking me if covering the surface of the granite defeats the purpose then I'm lost. An ionizer is a very good suggestion but they are not inexpensive. If the table is grounded and the metal bars are on a grounded mat, laminate etc. then

Re: SERA and ROSA

Electronics Forum | Tue Nov 09 11:42:37 EST 1999 | Dave F

Jeff: Try this: ROSA. John�s spot on. I�ll add that it is a fluxless method that reduces the oxides in an aqueous solution. Another source of information is: Trench, M., Hillman, D., Lucey, G., "Environmentally Friendly Closed Loop Soldering,"

Nitrogen and dry cabinet

Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal

Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s


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