Industry News | 2009-11-10 11:17:26.0
NamA Electronics to represent APS Novastar in Korea, Southeast Asia, and the Philippines
Industry News | 2010-08-10 10:43:15.0
APS Novastar's new video provides an overview of its SPR line of Stencil Printers for printed circuit board (PCB) assembly and demonstrates the ease of product set up and use.
Industry News | 2010-09-24 11:43:04.0
Reflow Oven video providing overview of APS Novastar's Reflow Oven products for lead-free and lead based reflow soldering, curing, and thermal cycling applications.
Industry News | 2010-06-25 10:20:29.0
APS Novastar announces release of its new LS60V-LED Automated Pick and Place Machine specifically for LED placements applications.
Industry News | 2009-08-13 16:06:15.0
Recipient of the 2009 Global SMT Equipment Customer Service Leadership of the Year Award
Industry News | 2013-08-16 12:04:49.0
DDM Novastar welcomes customers, prospective customers and trade media representatives to attend the company's Open House scheduled for September 12 and 13, 2013.
Industry News | 2014-05-12 11:02:56.0
DDM Novastar introduces new entry-level pick and place machine.
Industry News | 2018-06-17 16:31:20.0
DDM Novastar is pleased to announce the return of Brian Osterhout as DDM Novastar’s director of engineering. Brian has over 30 years of machine design experience, with a broad background in product development and manufacturing. From 2005 to 2010, he worked as Senior Designer & Project Engineer for APS Novastar (DDM Novastar’s previous entity) and helped design the firm’s L Series Pick & Place machine, along with enhancements to the reflow oven and Stencil Printer product lines. From 2010 to the present, Brian continued to expand his knowledge base, working for a Philadelphia manufacturer specializing in fluid-film bearings. This added to his diverse background in fabrication and machining.
Industry News | 2013-09-27 11:37:01.0
DDM Novastar is pleased to announce the launch of the company's newest reflow oven, model GF-125 HC/HT, designed with five zones to provide a longer conveyor length and 2 additional zones to give better control over the soldering profile.
Technical Library | 2009-12-23 16:55:08.0
Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or zone, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a cyclone around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering.
