Electronics Forum | Tue Sep 18 10:22:22 EDT 2001 | jschake
Paste Flux / Reflow: Our experiments indicated that the combination of no-clean solder paste and air forced convection reflow produced the fewest tombstone defects, followed by water-soluble paste reflowed in air, and most tombstones occurring with
Electronics Forum | Thu Mar 17 11:15:26 EDT 2011 | circleprime
I did some investigating and it seemed that getting a reflow oven with an inert atmosphere could be the answer to the inconsistant wetting issues that we are having with a leadfree DFN-10 on one of our products. Here's my question(s). It seems that
Electronics Forum | Thu Dec 21 01:08:28 EST 2000 | Bentzen
Check out my article about reflow soldering in nitrogen atmosphere on www.smtinfocus.com Hopefully you will find some answers and more detailes on my web-site.
Electronics Forum | Wed Jul 31 20:07:16 EDT 2002 | russ
Never used an inert atmosphere with this paste but always had great success with it. It leaves a pretty fair amount of residue but that was its only downside if you could call it that. do you need to run inert?
Electronics Forum | Fri Nov 29 13:22:40 EST 2002 | fmonette
Here are the answers to your questions : The shelf life in sealed bag as indicated by the seal date is calculated to be a minimum of 12 months, when stored in a non-condensing atmospheric environment of
Electronics Forum | Wed Jun 18 07:26:42 EDT 2003 | rmurtuza
Do BGA packages absorb moisture to a great extent if kept exposed to an atmosphere of 300C and 60% relative humidity overnight? Should they be backed before reuse. How long can they be kept exposed without the requirement of baking. Are there any spe
Electronics Forum | Tue Aug 19 14:41:27 EDT 2003 | D Peter
Good point, I don't know if it will pull moisture from the atmosphere without a dry nitrogen purge. There's another thing to find out. Thank you
Electronics Forum | Fri Oct 03 05:27:24 EDT 2003 | kanwal324
the puspose of solder mask is to prevent exposure of cu tracks to atmosphere. the lesser thickness can effect the performance of board but it only depends on its application. if you are making telecom board then its not good to use the board.
Electronics Forum | Tue Jan 11 14:02:53 EST 2005 | DasalIntercept
Bag it. Static Intercept and Corrosion Intercept packaging will be able stave off atmospheric corrosion and protect your solderability for a long time. Write me at dasalintercept@hotmail.com for more technical information.
Electronics Forum | Wed Mar 09 12:33:17 EST 2005 | Patrick
All: All you using a nitrogen atmospheres with your lead-free waves? If not, why not, as I would think this might have benefits vis a vis reducing dross.
