Electronics Forum | Thu Feb 27 03:26:13 EST 2003 | damianlai
Hi, I would appreciate some advice / recomendations regarding conditioning of PCB's before use. Our standard PCB's are double sided and rigid multilayer FR4. We are currently baking everything over 3 months old for 2 hours at 125 degrees C. Is thi
Electronics Forum | Wed May 03 16:37:10 EDT 2017 | charliedci
I don't believe there should be any issues with the HASL finish. The issue is how long on the shelf and is a bake out required to remove moisture from PCB, as in any FR4 PCB's that may have had time to absorb moisture.
Electronics Forum | Sun Jan 19 10:45:04 EST 2003 | davef
For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. [Search for other bake recipes in the fine SMTnet Archives.] Alot of the determination of baking time is a function of: * Amount of moisture absorbed. * Amount of moisture you need to r
Electronics Forum | Mon May 15 12:36:12 EDT 2017 | edhare
I don't believe there should be any issues with > the HASL finish. The issue is how long on the > shelf and is a bake out required to remove > moisture from PCB, as in any FR4 PCB's that may > have had time to absorb moisture. > I don't believe
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Mon Feb 15 14:28:09 EST 1999 | Andy Bellworthy
Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc
Electronics Forum | Tue Feb 16 12:26:07 EST 1999 | S. Rose
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc |
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan
Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use
