Electronics Forum: baking out pcb fabs (Page 2 of 25)

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ

Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a

Re: Bare PWB bake out during circuit assembly

Electronics Forum | Wed Nov 10 09:42:05 EST 1999 | Boca

Generic fabs should not require baking. Some special cases like teflon and flex circuits take moisture very well, they often continue to require a trip to the oven. Best wishes, Boca

Re: Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain

Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon

Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve

Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men

Solder beading with PCB from different fab

Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid

TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s

Bare PCB reflow

Electronics Forum | Tue Sep 07 17:12:34 EDT 2004 | davef

No one knows what type of board you use. So, assuming you're talking a fairly standard FR4. Q1a. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? A1a. We'd guess your board could take 250*C for may

HIC turn Pink for PCB-URGENT

Electronics Forum | Tue Jul 06 05:33:46 EDT 2004 | ANDREW

1)What is the MSD level for PCB? 2)I have some PCB's with HIC (humidity indicator card ) has turn to pink at 50%. Should I bake the PCB prior to assembly process.This fab is a complex board with various kind advance package assembled on the board.

Moisture absorbtion in circuit boards

Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c

I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh

BGA attach eval.

Electronics Forum | Tue Apr 01 19:36:02 EST 2003 | iman

from my humble experience : 1) check if there is nickle contaminate in the gold bath? shd have report data from the PCB fab house. 2) check if your production did 48hr bake at 125degC, IF the BGA did not come in its "original" MSD cozy packaging.


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