Electronics Forum | Wed Feb 06 17:28:27 EST 2008 | blnorman
We have some components on a reel that are 2.3 mm in thickness and need to be baked out. The reel has a warning not to exceed 50�C. According to J-STD-33, the proper bake out is 67 days @ 40�C.
Electronics Forum | Wed Apr 26 08:13:47 EDT 2017 | spoiltforchoice
MSL 1 is unlimited factory floor time before reflow. I have spools that are 10+ years old and haven't encountered any issues using those parts. It goes without saying those parts are not exactly used in volume so its not a massive sample but that is
Electronics Forum | Thu Oct 31 13:46:40 EDT 2019 | johnce
Hello, I have searched the forums for this specific topic, but can not find the clarification I would like. I am setting up a baking system to "reset" SMD components using a vacuum-bake oven. According to the JEDEC-STD-033 standard, depending on th
Electronics Forum | Wed Jan 17 11:30:23 EST 2007 | Colleen Miller
We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these component
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Thu Sep 19 21:31:37 EDT 2019 | deanm
Briefly opening the door probably won’t affect anything significantly. If in doubt, add an extra hour to the bake time. A better approach might be to keep both parts in the oven for 25 hours. You have up to 96 hours before oxidation becomes an issue.
Electronics Forum | Thu Sep 19 15:39:16 EDT 2019 | qanalyst1
When baking parts at 90C that require 15 hours bake time with parts that require 25 hours bake time, is it acceptable to open the oven and remove the former (15 hours) parts and then continue the 25 hours cycle for the remainder of the parts in the o
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Tue Mar 17 07:40:19 EDT 2020 | sara_pcb
I am using PCBs fabricated by ISOLA HR370 material. The layer count is typically 8-10 layers. thickness is 2.0mm. What is the optimum time to bake prior to assembly. What is the Standard refereed to,
Electronics Forum | Fri Aug 17 12:03:46 EDT 2001 | davef
We knew they�d make you use those boards, didn�t we? Your boss could be correct, but then again, you might get away with baking. Entek coating thickness is often poorly controlled by fabricators. But if sample boards that you ran are OK, why not g
