Electronics Forum | Sun May 24 08:38:53 EDT 1998 | Dave F
| I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | Earl Moon Earl: We send the BGAs to a service "re-baller." Dave F PSI, 16833 FM 1431 #E
Electronics Forum | Mon Sep 19 21:35:54 EDT 2016 | shriram
Appreciate your suggestion. NSMD pads are used for this design, the anomalies we found are 1. the trace running between pads has a lesser solder mask height compared the other area of the pads. 2. the NSMD pads doesnot have a trench close to pad e
Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish
Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the
Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.
If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo
Electronics Forum | Thu Oct 26 12:40:49 EDT 2000 | NLykus
Antonio, I would need to have more profile information i.e. preheat temp (hold time) as well as soaking zone (time). What is the peak temperature and how long is it held there. Also, one more thing to check, because I have seen it in the past, is
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Sun May 31 15:57:51 EDT 1998 | Allen
I came across your question and have a good reply for you: We have been using a system to reball our BGA's made by a company called Galahad. They have been working with Hepco for distribution. Give them a call at 408-738-1880. The system is around
Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach
| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833
Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon
| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
