Industry News | 2013-04-17 11:13:48.0
IPC ESTC will feature eight professional development courses examining packaging, materials, design and assembly considerations in electronics, from bare board to end-product, May 20–21 and May 23, 2013, at The New Tropicana in Las Vegas.
Industry News | 2015-08-20 13:42:15.0
IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.
Industry News | 2021-01-04 12:44:32.0
The following is a statement by Chris Mitchell, vice president of global government relations at IPC, the global electronics manufacturing association, on recent actions by the U.S. Government to bolster the security and resiliency of the U.S. defense electronics supply chain.
Industry News | 2017-08-06 19:39:48.0
The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2016-08-13 20:26:34.0
The North American PCB Market Report, published last week by IPC – Association Connecting Electronics Industries® reported IPC’s final estimates of 2015 market size for rigid PCBs and flexible circuits in North America. Although North American PCB production decreased 4.3 percent in 2015 to $2.9 billion, the PCB market grew 1.4 percent to an estimated $3.4 billion. Growth in the North American PCB market was driven by flexible circuit sales, which increased in double digits in 2014, while rigid PCB sales declined slightly. The outlook for PCB sales in the coming year is for continued slow growth, with normal seasonal patterns.
Industry News | 2017-08-14 18:22:34.0
The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2009-10-16 16:10:36.0
User-Configurable Process Audit Tool
Industry News | 2012-01-21 17:21:43.0
LPKF will showcase the MicroLine 1120 P in Booth #2335 at the upcoming IPC APEX Expo.
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
Industry News | 2011-11-08 14:14:14.0
Michelle Ogihara, Senior Sales Manager with Seika Machinery, Inc. will attend the Seika Sangyo GmbH Booth 317 in Hall A2 at the upcoming Productronica International Trade Fair
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