Electronics Forum | Wed Feb 13 12:44:05 EST 2008 | ck_the_flip
Larry, from my days of working for a Telecom. company, Bellcore standards (now Telcordia) was our BGA Void guideline. There was some verbiage in the guideline that accounted for allowable VOID VOLUME ...keep in mind, VOID AREA and volume are 2 diffe
Electronics Forum | Fri Jul 29 16:20:57 EDT 2016 | davef
"ALPHA® EF-2210 is VOC-free, halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering. "[2016 Alpha Assembly Solutions] I assume that you're tal
Electronics Forum | Wed Sep 30 13:42:56 EDT 1998 | Chrys
Hello, I've been evaluating a bunch of wave solder fluxes and found one that is absolutely perfect. I'm so excited I can't wait to switch over. Unfortunately, I have to assure reliability, and the only test I have in-house is ionic contamination
Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef
General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo
Electronics Forum | Sat Oct 09 07:38:43 EDT 1999 | Dave F
| | | Hi, | | | | | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | | | | | Thanks,
Electronics Forum | Sat Feb 14 13:35:43 EST 1998 | ashok dhawan
| I'm in the process of running a no-clean paste evaluation. I'm presently writing the | specifications for the laboratory test requirements (SIR testing, flux testing, etc.). | So far, I've developed a very comprehensive set of test criteria usi
Electronics Forum | Mon May 24 05:53:24 EDT 2004 | johnwnz
Here's an interesting fact, some pastes just don't wet as well as others!.. there I've said it and now people will complain but that's life. Some pastes are formulated to run in air, some in N2, soem are specifically designed to be more aggressive fo
Electronics Forum | Thu Jul 06 16:00:11 EDT 2006 | samir
Ionic Cleanliness Testing: IPC-TM-650, Test Method 2.3.25, Section 5, "Dynamic Extraction Method", is the most commonplace method in the industry to test YOUR PCBA's for cleanliness. Run it through your process as normal, and send it out for testin
Electronics Forum | Mon May 07 15:46:45 EDT 2007 | Hoss
IEC 60601-1 is a UL regulatory standard for Medical Electronic Equipment. We recently ran the humidity pre-conditioning segment of this testing and have found electromigration repeatably in areas with hand soldered joints (remaining NC flux). IEC 6
Electronics Forum | Fri Jul 29 06:16:19 EDT 2016 | dmsm123
We do have a commen problem with flux residues after the wave soldering process, even after using correct wave soldering profiles recommended by the flux supplier, The following flux type is being used Alpha EF 2210 VOC Fre Bellcore No Clean water Ba
