Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Fri Sep 10 09:00:40 EDT 2004 | rlackey
Hi, It should get you at least a 1997 machine, but the age isn't as critical as the UPS level - you want at least 3.2.3. They are good machines & are well built, and at least comparable with any other second user machines (although not in the Fuji/
Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef
We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.
Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
Electronics Forum | Thu Mar 10 22:56:33 EST 2005 | davef
SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments
Electronics Forum | Sun Jul 28 15:29:06 EDT 2002 | davef
There's background and links to papers on black pads in the fine SMTet Archives.
Electronics Forum | Thu Mar 10 15:10:07 EST 2005 | bandjwet
In reviewing the myriad of BGA reliability tech papers there seems to be little commonality in the type of test protocols. There are tests that are industry specific, device vendor specific and customer specific. What guidance in terms of minimum me
Electronics Forum | Tue Jul 27 17:00:07 EDT 1999 | Dave Kennedy - APE South
How many layers is the board.... Is the BGA ceramic or plastic? Dave Kennedy APE South apecorp.com
Electronics Forum | Sat Jul 27 14:30:56 EDT 2002 | Juan C. Ruiz
Do you have any picture or reference how can we determine black pad or plating contamination. I have heard about a lot of problems regarding BGA's and normally these components are only replaced or heat it and that's it ,after that the boards are wor
Electronics Forum | Thu Oct 13 16:08:11 EDT 2011 | davef
BGA solder joint reliability is actually improved slightly from a double-sided reflow. [Jean-Paul Clech APEX 2003 Solder Joint Reliability of BGA Assemblies]
