Electronics Forum | Sat Aug 15 07:56:16 EDT 1998 | Clyde F.
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai PACE just came out with a new s
Electronics Forum | Wed Jul 22 13:57:03 EDT 1998 | bill
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai If you are doing any reballing
Electronics Forum | Fri Apr 12 15:48:33 EDT 2002 | jersbo
SPC for each assembly(I use C(for board defects)NP(for unit defects) at the end of reflow to determine process capabilities determine Control limits. Once control limits are set, inspectors stop the process until out of control limit is addressed and
Electronics Forum | Thu Apr 20 13:02:44 EDT 2000 | Robert Patrick
Hi.... I read your message and can empathize. I just joined PDR Infrared Systems. PDR offers an Infrared System for CSP/UBGA with X-Ray or Optical Inspection Packages. You may want to consider IR technology for UBGA before taking the plunge. Hop
Electronics Forum | Tue Apr 09 16:25:28 EDT 2002 | clarkk
Alan, You're right, mass inspection after assembly won't work. The inspectors will miss 25% (or more) of the defects, and the boards will be reworked before SMT operators can properly define defects and their sources. The company I work for tends to
Electronics Forum | Wed Apr 10 10:32:39 EDT 2002 | slthomas
Ask your compadres how you can control a process when it's output has already been completed? If you do second side assembly before you inspect the first side, you can't possibly apply real time corrective action. I know what I'm talking about in t
Electronics Forum | Fri Jul 23 10:47:31 EDT 1999 | Mark D. Milward
There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing th
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
