Electronics Forum | Fri Mar 21 10:28:27 EST 2003 | mantis
Sorry i didnt explain it vey well,the parts that are misaligned are always sitting next to these particular tanatlum capacitors.It affects 0805 parts and A tsop36 and can even cause a short on a bga right in the corner where the tant sits.If you chan
Electronics Forum | Fri Mar 21 11:25:07 EST 2003 | jonfox
His subject line is "Tantalum caps causing misaligned parts". Come on guys, I think he answered the question already. Is there any via/traces that connects the pads of the TANT to the 0805 and the BGA. Your two parts may be physically the same, bu
Electronics Forum | Sun Aug 02 20:31:22 EDT 1998 | karlin
Hi Bob, The weight of the TBGA is heavier then PBGA due to the Stainless steel heat sink. I have tried run them through the oven without paste. Due to the high lead content( 90Pb/Sn10), the "solder: did not melt. Still see the misalignment issue but
Electronics Forum | Wed Mar 14 16:23:01 EDT 2007 | J
I am not sure Ersascope and X-Ray will tell you the results you are looking for. My experience with x-ray has proven that misalignment, voids, and bridging are really the only failures that can confidently be observed. You may have solder in place,
Electronics Forum | Wed Aug 15 14:12:49 EDT 2012 | hegemon
I saw a similar problem a couple years ago. In our case the issue was the original manufacture of the devices. The high temp spheres were misaligned from the beginning, and subjecting these parts to SMT reflow made the problem worse, and created is
Electronics Forum | Mon Jan 06 23:25:29 EST 2003 | Dreamsniper
I made an experiment with our semi-auto stencil printer and used my naked eye to decide whether the alignment and deposition is pass or fail. I based the results in percentage and 100% is perfect result. Now here's the question: Can anyone tell me w
Electronics Forum | Thu Oct 30 00:12:13 EST 2003 | Grant Petty
Hi, Another option we have used here in house is to remove the unwanted BGA balls with solder wick, and then to manually place them on the PCB foot print. This eliminates the pick and place machine's optical centering freaking out because the balls
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Tue Aug 24 06:29:04 EDT 2004 | johnnybravo
1. quite easy. if you create a smart database for yourself to keep the algorythms easily available, it becomes even easier. 2. reliable, once they've been set up, and "burnt in". in the first couple of weeks they tend to have "child sicknesses". su
Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon
Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t
