Electronics Forum | Tue Jun 14 15:18:13 EDT 2005 | jdumont
How do I send pics....sorry for the ignorance.
Electronics Forum | Tue Jun 14 20:03:06 EDT 2005 | davef
click on the email link, next to the Lou Reed icon, then paste the pix in the form
Electronics Forum | Wed Jan 27 04:01:46 EST 2016 | slouis2014
Thanks alot for the info
Electronics Forum | Fri Nov 27 00:36:02 EST 2015 | slouis2014
I just encountered a BGA design were in, underneath the BGA is a silkscreen that covered the entire bottom of the component except for the copper pads. Can you give any information and advice for this type of design.
Electronics Forum | Wed Dec 02 20:41:13 EST 2015 | slouis2014
Thanks for the link. Their is a white silkscreen underneath the BGA instead of a green soldermask. Attached is a picture of the BGA. Does these affect the solderability for the component.
Electronics Forum | Mon Aug 23 21:47:49 EDT 2004 | Jefflee
Hi Terry, Thanks for the reply,but if the Bga are in big quantity like 10k and above,is there any faster method to solve this problem
Electronics Forum | Tue Jun 14 18:26:32 EDT 2005 | GS
You can find useful informations also on last review of IPC-7085 : Design and Assembly Process Implementation for BGA. Regards GS
Electronics Forum | Tue Jun 21 11:46:04 EDT 2005 | kenscj
Hi dave, Thanks for the comment. I have another issue. The board already pass Test and Burn-In processes, but after 2 months the BGA contact is found open (no contact on certain balls). How can that happen? Is it during build, the solder ball alrea
Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj
Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe
