Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Thu Sep 09 13:25:11 EDT 2004 | kbayram
Thank you all for your replies. Coincidently I am in the UK and doing research for a purchase in the first half of next year for export. At that price range what year of manufacture are we looking at? Looking at the specs it looks like a good, w
Electronics Forum | Thu Feb 11 07:24:40 EST 2016 | truewanderer
I'm planning to design the pcb of my project. The controller used is having 136 pins and the package is P-LFBGA. So i think i need to design a 6 layer board for better performance. I haven't designed a multi layer board before. So what are things tak
Electronics Forum | Sat Apr 10 10:01:43 EDT 1999 | Jeff Price
| | I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling | | | | thank you | | | -I have had wonderful results with
Electronics Forum | Mon Nov 25 12:16:03 EST 2002 | Dragonslayr
I have conducted 2 BGA rework studies over the last 3 years or so. Each time I came to Air-Vac as the prefered machine. I looked at all the models mentioned in the other posts here plus a few more. As a final step in the study I took the actual oper
Electronics Forum | Tue Sep 01 10:16:10 EDT 1998 | Mike Cox
| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th
Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike
| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.
Electronics Forum | Thu Feb 23 18:05:53 EST 2006 | kennyg
What are some general guidelines for the minimum proximity of apertures to a stepdown on a stepped stencil. I have a step from 7 mils to 5 (one mil step each on the top and bottom). How far does the step need to extend beyond the apertures on the
Electronics Forum | Sat Aug 05 09:19:50 EDT 2000 | JAX
Felix, 1-5: A step stencil is simply a stencil with area's of different thickness( step down's ). They are used for multi-package boards( BGA, fine-pitch, ..... ). They keep you from deciding whether or not you want the fine-pitch or the BGA devices
Electronics Forum | Fri Jun 09 14:00:08 EDT 2000 | khalid
I am not aware if there is any standard but INTEL web site has some really good step by step process for reworking BGA's. Khalid Saeed
