Electronics Forum | Sun Sep 08 15:41:30 EDT 2013 | rodcr
I read an article about signal integrity losses and ENIG applied to all of the traces on the board. Doesn't solder mask protect the traces? Why would you need ENIG on the entire board?
Electronics Forum | Mon Jun 15 20:37:29 EDT 2020 | travishemen
Try sending your boards to rework before SMT and have them remove the excess solder from the fiducials. It usually works great until someone accidentally removes the entire fiducial.
Electronics Forum | Tue Jun 16 14:35:13 EDT 2020 | dwl
for the fiducials, try a donut shape instead of a disc. The HASL solder seems to settle more evenly on a donut than it does on a dic.
Electronics Forum | Tue Jul 13 16:35:25 EDT 2004 | Richard
Sounds like your Si plalladium finish has oxide on it from the firing or sitting around too long. I used to assemble LTCC and have had plenty of dealings with this matter. The best and easiest is to get an active type flux and solder paste. AIM makes
Electronics Forum | Sun Sep 08 18:06:30 EDT 2013 | davef
Protect the board: If solder mask protects the board, the level of protection is limited and inconsistent. If you want protection, you need the be thinking conformal coating. Selective ENIG: I believe the reason solderability protection, except mayb
Electronics Forum | Sun Jun 14 03:02:14 EDT 2020 | kylehunter
We did a batch of boards with lead free HASL that we thought was leaded. Using standard leaded paste worked, but we did have some wetting issues. The issues were resolved when switching back to leaded HASL. Can't speak to your specific fiducial issu
Electronics Forum | Wed Jun 24 16:51:25 EDT 2020 | kumarb
Hi. Taking this from a total different angle - why not use ENIG to avoid this issue but find more competitive suppliers? We source from offshore all the time and finding that due to this dreaded virus - the market pricing is soft. Many are willing to
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Mon Jun 15 16:31:25 EDT 2020 | rgduval
You may find some wetting issues running LF HASL with 63/37, as your reflow temperatures will be significantly below the LF reflow. On fiducials...if you don't have a quote for your boards with ENIG, I would recommend at least checking it out. It's
Electronics Forum | Fri Aug 13 16:54:20 EDT 2004 | davef
If the terminations on your components are not barrier plated, you must be very careful about the amount of time you stay above liquidous. As you'd expect, longer is not better. The longer you stay at liquidous, the more of the component terminatio
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