Electronics Forum: blistering and trace (Page 2 of 7)

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto

I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.

CSM-84 pick and place machine.

Electronics Forum | Wed Feb 16 19:55:34 EST 2011 | jeffr

There are three versions of the CSM84, old, older and really old. The older machines can only do fun things around the PCB if you toggle RUNMODE 1 from AUTO to be UTILITY... then you can use the utility program "PIC" to trace around the PCB or do min

Manual Pick and Place Manuals

Electronics Forum | Thu Sep 13 03:10:09 EDT 2012 | weyes

Optimize the pcb assembly layout can enhance the performance of the converter for switch-mode converters, excellent PCB layout is critical to the performance of the best system.If the pcb assembly layout is poorly designed, it may result in the fol

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Thu Nov 15 03:07:35 EST 2012 | nikyta

Thanks for your reply. As already said by Anvil1021, is not a good idea to mix Lead and Bismuth! Stay away from Bismuth if you have even the slightest traces of Lead on yours PCB, stencil, squeegee, spatula, blade, cleaning paper or cleaning cloths,

Block repeat and fiducial relation

Electronics Forum | Fri Aug 22 15:27:13 EDT 2008 | wayne123

this is the order that I use. 1. Teach pcb origin 2. Teach fiducial location 3. dial in vision on fid in mark info. 4. go into mount and verify that the primary image is on in x/y (after perfoming a teach trace condition) and then do any offsetts if

CSM-84 pick and place machine.

Electronics Forum | Wed Feb 16 01:06:13 EST 2011 | vinitverma

Dear Gabe, Once you have the mount data in the program, you can move the camera automatically to the location by tracing each location one by one. If I remember it correctly it is done by having the location highlighted in the program and then by pr

ICT and specifying PCBA testing

Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef

Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input

Desiccants and pcb finish degradation?

Electronics Forum | Tue May 15 21:57:06 EDT 2001 | davef

Welcome!!! Where the hay ya been??? Sorry bud, were lining-up with your fab [it hurts me to say that, but when yer  ] We used to dry pack with desiccants, also. Its probably an old MIL-STD-2073-1C requirement [er something like that]. We qui

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen


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