Industry News | 2013-02-20 18:54:10.0
IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
Industry News | 2011-01-12 17:40:04.0
Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.
Industry News | 2018-10-18 10:17:48.0
How to attach a thermocouple to a target PCB?
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | ESD Control Supplies
3500/32-01-00 3500/32-01-00 CONTACT JESSICA Email: sales3@amikon.cn Skype: jessica01235483 | Phone: 86-18030235311 https://www.moore-plc-center.com/ http://www.mvme.cn/ COMPANY PROFILE We are spare parts specialists in industrial automation
New Equipment | Rework & Repair Equipment
Zhuomao ZM-R6200 BGA Chip Removal Machine for Motherboard IC Repair Product Application Factort price automatic bga replacing machine iphone motherboard repair station ZM-R6200 can desolder and solder all the BGA Chip, remove and replace different
Technical Library | 2022-02-21 19:49:16.0
The ability to undertake non-destructive testing on semiconductor devices, during both their manufacture and their subsequent use in printed circuit boards (PCBs), has become ever more important for checking product quality without compromising productivity. The use of x-ray inspection not only provides a potentially non-destructive test but also allows investigation within optically hidden areas, such as the wire bonding within packages and the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips).
New Equipment | Rework & Repair Equipment
Seamark Zhuomao high fully automatic BGA rework station ZM-R8650 with vision alignment system for motherboard repairing We provide customized BGA rework solution, you are welcome to contact me (Rita Li) by Whatsapp/wechat/viber:0086-134 3448 1030