Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Wed May 27 10:19:43 EDT 1998 | Jerry
We have no problems but orientation does matter. Orient with longest side of component body perpendicuar to wave. In other words the same preference as with through hole DIPS. Idea is the same as for through hole, that the surface tension will ten
Electronics Forum | Wed Mar 05 08:05:46 EST 2003 | Yngwie
Thanx Marc..this is good input.
Electronics Forum | Tue Mar 04 00:55:12 EST 2003 | nifhail
In the double sided SMT process assembly, normally the bottom side will be processed first, due to it's lesser density as well as it's lesser heavy components. Apart from worrying about the component falling down, what are the potential problems that
Electronics Forum | Thu Nov 16 08:57:00 EST 2017 | jandon
We found used Ersa HotFlow 2/14 reflow oven that does not have bottom side preheaters. Can it be easily and safely used in normal high mix/low volume production or is it built for specific products which does not need bottom preheaters?
Electronics Forum | Tue Mar 04 13:32:17 EST 2003 | MA/NY DDave
Hi Unless I am missing something, None if done right. YiEng, MA/NY DDave
Electronics Forum | Fri Mar 07 03:37:26 EST 2003 | emeto
Hi Ygwie, My experience shows there is not unique answer.Actually it depends on design,printing reflow or wave.It might be top side with lesser cmps.Top side might have fine pitch or BGA or CSP,LLGA ....,so you have better planarity when the PCB is b
Electronics Forum | Tue Mar 04 18:38:12 EST 2003 | ruggi
Most of what we do (across 800+ varieties) is bottom side first. In general, there really aren't any problems as long as our Customers follow the .25g/cm wetted lead perimeter spec for weight (which many don't), and don't mount tall components on th
Electronics Forum | Tue Dec 09 12:26:45 EST 2008 | greene08
I have virtualy no experience with placing bottom side components. We have a new board coming that will have a few R's & C's bottom side. Can anyone give oppinion on dispensing glue dots vs. applying adheasive with a stencil ? thanks
Electronics Forum | Tue Nov 27 06:11:42 EST 2007 | shy
Hi Loco, my PCBA got top side and bottom side and 90% SMT and 10% THP (top side) which need to be cover by wave solder. And that's why i need to go through reflow and wave.
