Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You
Electronics Forum | Thu Aug 31 21:15:46 EDT 2000 | Dave F
From the SMTnet Library try: http://www.merix.com/resourcecntr/papers/osp.doc http://www.merix.com/resourcecntr/papers/hasl_alt.doc http://www.itm-smt.com/articles.html * "Organic Solderability Preservatives" * "OSPs - Better Living Through Modern Ch
Electronics Forum | Wed Aug 12 13:11:37 EDT 1998 | Tyler Posey
| Can someone point me to where I can get a copy of the spec for these | finishes. | Thanks | Richard Jackson | richardj@tanisys.com | Jackson_Richard@csi.com Richard We have also been looking into OSP's. Enthone-OMI is a source for anything you ne
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.
Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va
Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Thu Sep 27 16:40:12 EDT 2012 | davef
Ideally, shelf life should be twelve months from application, but not all OSP's are the same so check manufacturer's instructions
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
Electronics Forum | Thu Aug 31 12:17:56 EDT 2000 | mike weekes
We are considering alternative Board Finishes to our existing HASL process. The HASL effects opens on 25 and 20 mil packages after reflow and we know if the advantages of CuOSP and other alternatives. OUR Concern: Is there a shelf life and handlin
