Electronics Forum | Thu Jan 05 15:42:26 EST 2006 | samir
Grant, The strength of the joint in a CCGA is the column for one...it's more ductile, made out of 90% Pb, and it's meant to compensate for the massive CTE mismatches between the ceramic and the board (ie the columns flex to relieve stress from the e
Electronics Forum | Thu Jun 20 05:50:29 EDT 2002 | edahi
thanks yeah we are very much looking at the reflow because the package is ceramic tough "scratch" the tape idea because the gold pad is a marking area and the surface might be contaminated and it might cause illegible marking. the slow ramp up i'll
Electronics Forum | Thu Jul 15 12:07:36 EDT 1999 | Mark
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | There are a number of methods available. 4 of them are discu
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Sun Feb 15 18:07:18 EST 1998 | Scott McKee
| I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The I
Electronics Forum | Thu Jun 23 09:11:45 EDT 2005 | russ
You should be fine with this if it is a plastic body, If it's ceramic or some other kind of heavy package you will probably want to check. We process PBGAs up to 35x35 with no glue on many occasions.
Electronics Forum | Thu Feb 18 17:15:24 EST 1999 | Jason Gregory
Check this company out....Winslow Automation. They have a real easy "preform" for reworking BGA's. You just wick the old solder off, flux the packages, attach an appropriate preform, reflow it with a corresponding profile, remove the water-soluble pa
Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F
Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow
Electronics Forum | Thu Feb 18 21:51:48 EST 1999 | Dave F
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | 3: I'm unaware of such documentation, but then again documen
Electronics Forum | Tue Feb 24 04:09:31 EST 2004 | Sam
Does anyone have any experience with regards to reworking thru-hole ceramic capacitor D.I.L , taking into acount thermal considerations associated with these packages. The reason we are having to rework is because the device is wavesoldered on a th
