Electronics Forum: class%' and '8%'='3 (Page 2 of 10)

IPC Class II and Class III reliability

Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef

MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but

PCB and component handling guidelines

Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture

PCB and component handling guidelines

Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture

New Pick and Place Operation

Electronics Forum | Thu Jun 03 08:03:22 EDT 2004 | vinitverma

You can have a look at Assembleon (formerly PHILIPS EMT) equipment. They have equipment ranging from rated speeds of 6500cph to 150,000cph. I guess their OPAL XII should be the best fit machine in terms of its capability and speed both. It can do fro

Manufacturing and test room cleanliness

Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas

J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 13:04:35 EST 2001 | slthomas

We've got a problem with a fine pitch board that has about .005" registration error at each end (towards the center of the board) when it's printed. Apparently we've got a case of board stretch generated at the fab shop. I still have to do some mea

Manufacturing and test room cleanliness

Electronics Forum | Mon Feb 05 10:12:32 EST 2007 | slthomas

The use of booties isn't required per se, just considered a standard step necessary to reach the 10,000 target. You also need to vacuum (central vac system, NOT exhausting into the room) daily, mop weekly, have a one piece floor, blah, blah, blah....

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm

Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate

IPC Class II and Class III reliability

Electronics Forum | Wed Apr 09 09:36:18 EDT 2003 | iman

what r your test running parameters? what end-application?

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:18:27 EST 2004 | Simon UK

Hi Dennis, It is all dependant on what you state for the class of product i.e. Class 3 is the top end acceptance criteria used mainly in Aerospace and Military. You have 2 terms you need to grasp to avoid confusion. 1. Acceptance Criteria 2. Target


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