Electronics Forum: cleaning and pcb and melting (Page 2 of 8)

lead free platings and tin lead

Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef

NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack

Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one

Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re

BGA ball and PCB pad

Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W

There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay

First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183

BGA ball and PCB pad

Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan

Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor

BGA ball and PCB pad

Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan

Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Thu Nov 15 03:07:35 EST 2012 | nikyta

Thanks for your reply. As already said by Anvil1021, is not a good idea to mix Lead and Bismuth! Stay away from Bismuth if you have even the slightest traces of Lead on yours PCB, stencil, squeegee, spatula, blade, cleaning paper or cleaning cloths,

MPM Accuflex problems and errors

Electronics Forum | Tue Mar 30 06:27:22 EDT 2010 | ristikas

It happens on the middle of the stecil cleaning. The camera and the cleaner will stay under stencil in half way back. Then machine asking the initate the motors. If to press initate then the pcb stopper will hit the rails. Usually we move camera and

Re: Buying stenciling and pick and place equipement.

Electronics Forum | Mon Dec 20 13:39:08 EST 1999 | Wolfgang Busko

Hi Clarissa, seems to be a real start up situation you are in. For the printing there is IMO no need to buy any sophisticated automatic-vision-alignment-self-cleaning-inline-and-more-machine. Features you need: - adjustable in X-,Y-,Z-axis (individu


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