Electronics Forum | Wed May 31 13:23:48 EDT 2006 | slthomas
You don't say anything about the appearance of the solder joints themselves. That would go a long ways towards identifying and possibly resolving your issues. Heating and cooling could affect performance if you have a/some cracked or otherwise loose
Electronics Forum | Fri Dec 05 13:57:37 EST 2014 | emeto
Hi, Do you observe any part warping in the corners? Do you X-ray 3D? I really doubt that all joints are fine and the part wouldn't work, but if so, your problem should be part related.If you have a temperature controlled facility I wouldn't even thi
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Sat May 27 08:58:07 EDT 2000 | Thanas
Hi, I'm new in SMT & confusing to define the soldering defect criteria of cold solder, dry joint & dewetting. & what's the root cause for them ? FYI, I had read the IPC-A-610 rev. B , but doesn't help much. Any advise is very much appreciate. Thanks
Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F
Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c
Electronics Forum | Thu May 18 11:00:51 EDT 2006 | Chunks
Thanks Doctor - as always, you're right. I must've been typing with my mittens on. It's starting to get cold on this part of the planet these days. I wasn't blaming anyone, just trying to take a few questions marks away so "we're" left with the an
Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto
Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a
Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson
This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l
Electronics Forum | Fri Sep 22 17:27:51 EDT 2023 | calebcsmt
How does one determine a cold joint seam vs simple cooling lines from solder cooling at different rates or part of the joint not reaching liquidous (very large pads)
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