Electronics Forum: component popped off (Page 2 of 150)

parts popping off during reflow

Electronics Forum | Fri Sep 28 09:30:07 EDT 2001 | kmorris

Just had a similar phenomenon 2 days ago. May relate to your issue --- or not. Like you, I did a once over looking for mechanical obstruction & couldn't find any. Ran a thermal profile on the offending PCB & all checked out. Looked in end of oven

BGA dropping off the board

Electronics Forum | Thu Feb 14 07:49:29 EST 2008 | aj

There was hardly a dropped component or components under the BGA ? just a thought. aj...

BGA Detached off the board

Electronics Forum | Mon Aug 11 09:21:04 EDT 2008 | davef

Sounds like solder is not taking to the pads of the BGA interposer. Check the solderability of the component.

BGA dropping off the board

Electronics Forum | Thu Feb 14 08:14:12 EST 2008 | davef

Questions are: * Do the BGA pads on the board take solder when you solder them by hand? * What is the temperature on the BGA pads during reflow? * What is the temperature on the other component pads during reflow?

BGA Detached off the board

Electronics Forum | Mon Aug 11 13:55:09 EDT 2008 | guhansub1

Your defect may be possibly due to black pads, although it is rare on component side. Is your BGA pad finish ENIG? If so, inspection using a SEM can give clues on the presence of black pads

BGA dropping off the board

Electronics Forum | Fri Feb 15 06:21:34 EST 2008 | marjorie

Thanks for the comments and advice. The rest of the components have good solderability except for the BGA that fell off. Our production is high mix low volume so the quantity was very small. I'll check the pcb lands next time I run. It could be a con

BGA dropping off the board

Electronics Forum | Mon Feb 18 02:08:06 EST 2008 | lococost

4 days seems a lot. You could be losing flux activation causing poor wetting on the enig. Check your suppliers data sheets for paste life. If it was contamination on the PCB, you'ld expect other components to solder badly as well. Try using a bra

BGA drop off from the boards

Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah

Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad

blocking off stencil apertures with tape

Electronics Forum | Wed Oct 10 13:49:12 EDT 2001 | stepheno

I recently started at a new company. They have a variety of bare PCB's and most have aprox. 20 variations. Maybe about 1/3 of each board on average are non-populated locations. They buy one stencil for each PCB but then use scotch tape to block of

Parts Blowing off in Reflow Oven

Electronics Forum | Thu Jul 14 01:08:30 EDT 2005 | pyramus

I too experience it too component being blown out of the pad also using heller 1800. In my case I also did check entry and exit of reflow so far no obtruction. Also checked profile setting also ok. Mine is a 0603 Chip capacitor... but problem is o


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