Electronics Forum: components and edge and stress (Page 2 of 4)

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:00:12 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

V-scoring design and equipment questions

Electronics Forum | Mon Jun 12 17:32:17 EDT 2006 | flipit

Hi, A little off subject but I just finished a quick little experiment where I placed 0201 to 1206 and some ceramic resonators at specific distances off the scored edge. The distances from scored edge ranged from 0.025" on up at 0.025" increments.

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter

I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef

Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh

Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr

Re: BGAs and vapor phase

Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko

| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som

Re: BGAs and vapor phase

Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko

| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi


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