Full Site - : copper fiducial on hasl finish (Page 2 of 2)

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 15:27:36 EDT 1998 | Dave F

| | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and s

Problem with less soldering material on the pins

Electronics Forum | Thu Apr 20 02:27:11 EDT 2017 | pavel_murtishev

Mile, Please tell me more about your soldering process: - Are soldering process parameters the same for all three pins? - Is unsoldered pin connected to thermal heavy copper polygon? - What is your board surface finish? HASL? - Sn/Pb or LF process?

HASL Fiducial Disposal

Electronics Forum | Mon Jul 29 17:07:10 EDT 2002 | dsorg

We remove the fiducials by pushing sideways on them with a hot soldering iron. The copper pad separates from the FR4. We collect them and dispose of them. We have thought of disposing of the rail material with the boards, but our recycler doesn't w

Re: Fiducials

Electronics Forum | Mon Feb 22 14:02:17 EST 1999 | Michael Allen

We have resorted to adding a ring (or donut) around our 0.040" round fiducials. The donut acts as a "plating thief" to minimize the thickness of the copper plating (in the case of HASL finish) and of the solder plating (in the case of solder-plated

Fiducials

Electronics Forum | Fri Jul 09 18:36:48 EDT 2010 | rway

We don't use flex pcbs but have the same issue here. Most of our pcbs are HASL finish. I have looked at silver and gold immersion and both look really good under my color camera on my AOI. However, gold is more pricey. There is no additional cost

OSP Handling

Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef

Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3

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