Electronics Forum: copper foil reflow (Page 2 of 50)

Modems reflow mistake

Electronics Forum | Mon Oct 12 10:26:52 EDT 2015 | eniac

My greetings to all. Time to time I receive the next results of modems soldering: http://i.piccy.info/i9/71ae4c358c6e4bc3f1cbf140495bc437/1444660170/135005/872954/GL868_7.jpg or http://i.piccy.info/i9/d1181be142e285a39b49b81d37bde72a/1444660270/1

Modems reflow mistake

Electronics Forum | Fri Oct 16 12:41:29 EDT 2015 | deanm

Do you have a solderable surface (walls)? It looks like most walls have a silver arc at the top but some do not (especially the last link) which I interpret that it has been plated (in most cases). Is it possible that the component does not have suff

Re: 2nd reflow

Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc

Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can

qfp reflow problems

Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ

The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme

double sided reflow

Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason

We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?

Re: Best reflow temperature

Electronics Forum | Thu Sep 16 12:06:29 EDT 1999 | Scott S. Snider

Hi, Can someone pls suggest to me the best reflow temperature setting for a force air convection oven. The details is as follow. 1) Heller 1700s 2) 12 zone---6 top and 6 bot 3) Solder paste --- Qualitek 691

Re: double sided reflow

Electronics Forum | Thu Jun 22 12:25:07 EDT 2000 | Boca

Jason, What Chrys said! Don't try to run the bottom cooler, tried it in the mid 80's, don't work and don't want it to work. If one side of a fab is maintained cooler than liquidus and the other side into reflow it would have an easy 40C temp diffe

Drop components in Secon reflow

Electronics Forum | Sat Aug 13 11:14:11 EDT 2005 | Ftiscar

Does any body knows if there is a design rule on copper pads against component weight so they do not drop on secon reflow process?

What caused this reflow issue?

Electronics Forum | Wed Apr 16 09:25:55 EDT 2008 | hussman

Do you specify copper weight on your boards? This could be the difference between the the boards. Also the finish will be different between the boards as well. These two factors are enough to cause bottom side parts to reflow and fall off. In eit

Non-wetting: PTH on double-side reflow

Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN

Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like

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