Electronics Forum | Thu Dec 07 14:17:03 EST 2006 | russ
I would bet that it is a SMT adhesive used to ensure that the BGA does not move during a secoindary reflow prcess. this glue is easily removed with a soldering iron. Russ
Electronics Forum | Tue Jan 22 22:23:48 EST 2008 | amarpreet41
Thanks, I am working on to prevent solder bridging. Tried fine tuning reflow profile, solder printing looks fine. Any further ideas??
Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala
Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
Electronics Forum | Fri Jun 10 13:04:04 EDT 2011 | spitkis2
Any suggestions as to what can cause a PBGA's corner to warp down during installation process on a rework system? A couple solder balls bridge at the corner. It appears at the pin 1 corner where the metal indicator of a BGA is exposed. I am wonder
Electronics Forum | Mon Aug 03 03:24:03 EDT 2015 | leeg
What positions do you need to measure? Pad to Pad or corner to corner?
Electronics Forum | Wed May 31 10:44:31 EDT 2000 | Neil Peaslee
The Admin Corner allows us at SMTnet.com to correspond with the users of the site. Any problems you experience with the site or recommendations you have for the site should be entered in the Admin Corner. Questions and comments related to SMT and el
Electronics Forum | Thu Aug 13 12:05:29 EDT 1998 | Cunli Jia @ SMTnet
The new SMTnet Admin Corner is meant for public discussions with SMTnet staff and among SMTnet users on site design issues, policy issues, and announcements. We hope this corner will keep the technical forum focused and help us provide the best servi
Electronics Forum | Mon Jun 13 12:21:50 EDT 2011 | jimby56
Try putting a .010" shim under each corner during rework reflow. This will keep corner balls from shorting out.
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