Electronics Forum | Fri Jan 18 14:39:07 EST 2013 | davef
Main issues with LGA voiding are: * Design * Material selection * Thermal recipe For design, loo here http://blogs.smtnet.com/smt/other/qfn-btc-design-guidelines-thermal-pads-etc/ BR, davef
Electronics Forum | Mon Feb 25 10:49:09 EST 2013 | davef
Try: Attn: Bernhard Unkelbach Ingenieurelectronic Maedelegabelstrasse 1 81825 Muenchen Germany Phone: 011-49-89-4300 717 Mobil: 011-49-172-8241 548 email: b.unkelbach@unkelbach-net.de BR, davef
Electronics Forum | Tue Feb 05 15:31:58 EST 2013 | davef
As a quick response, look here: http://www.cotorelay.com/images/stories/coto_wp__reliability_ver_003.pdf We receive no benefit from, have no investment in nor know any employees of the company listed above. BR, davef
Electronics Forum | Sun Feb 10 11:11:53 EST 2013 | davef
Try Manncorp and APS. I'm not sure that either one will meet your 01005 requirement. BR, davef
Electronics Forum | Thu Feb 14 11:30:04 EST 2013 | davef
Yeh, I love the idea of tankless, but ... Tell ya what, when I'm at IPC APEX next week, I'll poke around on using tankless in a mid-to-low volume plant. BR, davef
Electronics Forum | Thu Feb 14 09:41:03 EST 2013 | davef
Look here http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=64413 BR, davef
Electronics Forum | Thu Feb 14 16:18:18 EST 2013 | davef
Adrianus: If your current reflow process is capable and in-control, don't change a thing. BR, davef
Electronics Forum | Fri Feb 15 14:45:30 EST 2013 | davef
Yes, the standard applies to things that are soldered. Read this ipc.org/TOC/J-STD-002C.pdf BR, davef
Electronics Forum | Fri Feb 15 16:56:46 EST 2013 | davef
I'll throw my hat in the ring that says, "At least 95% of the pads must be properly wetted." BR, davef
Electronics Forum | Wed Feb 20 12:44:21 EST 2013 | davef
From IPC APEX ... Hege is correct ... ALL pads have to be 95% wettable or better. BR, davef
