Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Mon Feb 05 14:45:54 EST 2001 | pteerink
Thanks Pete, Looks like I got the info I needed Phil
Electronics Forum | Mon Nov 15 14:40:38 EST 1999 | Bob Smith
Hi, I have a problem I've never seen before so I hope someone here can help. A recent batch of PCBs arrived where the copper lands delaminate with a small pull. Normally you have to pull pretty hard and the whole land comes off the substrate. These
Electronics Forum | Thu Nov 25 20:28:43 EST 1999 | cklau
hello, One way to prevent copper land delamination is to applied Anchoring spurs also referred to as "tie-down tabs" or "rabbit ears".These are a metal projection around a land.This features is fully captured by the cover lay (cover coat) that is n
Electronics Forum | Mon Feb 05 11:45:07 EST 2001 | peterbarton
Phil, One source for this information is form the manufacturer Park/Nelco. They have a large website and give specifications for all sorts of laminates, including FR4. Try http://www.nelcointernational.com/parknelco/fr4epoxy.htm. I'm sure that ot
Electronics Forum | Mon Nov 06 16:27:48 EST 2000 | Boca
Bingo! Sounds like you solved your mystery. You've checked your key process steps, the product has been running in your processes for some time with no process changes. This all points back to one of your process input, i.e. the fab. Experience s
Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F
Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l
Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal
In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Thu May 07 07:17:45 EDT 2009 | kareal
any other suggestion for it?
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