Electronics Forum | Thu Oct 27 14:17:49 EDT 2005 | james
I agree the stiffness is definately the problem.
Electronics Forum | Thu Oct 27 09:23:36 EDT 2005 | rlackey
Hi Russ, Kemet - http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfilesname/F3102CE.pdf/$file/F3102CE.pdf You want page 29 of 30 of this PDF Murata - http://www.murata.com/catalog/c02e11.pdf Page 132 of the catalog, or 134 of the PDF.
Electronics Forum | Wed Oct 26 11:02:17 EDT 2005 | Rob
I wouldn't say we've escaped either - Fuji blade wear is heavily up at the moment.
Electronics Forum | Thu Oct 27 08:46:58 EDT 2005 | james
Yes I would have to agree Kemet is the worse. I believe our feeders are just not strong enough to handle the thickness of the tape. It seems to need alot of force to move and to roll the tape through.
Electronics Forum | Thu Oct 27 09:50:10 EDT 2005 | russ
Thanks Rob, Our tape does meet the Kemet spec but I am actually wondering if there is an EIA spec or something to compare to.
Electronics Forum | Thu Oct 27 12:58:33 EDT 2005 | gregp
EIA-481-B Max tape thickness 1.1mm (not including bottom and top cover tapes which can be .1mm max each) Of course a 1.1mm thick piece of steel will be stiffer than a 1.1mm thick lasagna noodle (already cooked). Is the thickness the issue or is it t
Electronics Forum | Wed Oct 26 10:21:28 EDT 2005 | russ
We are also experiencing problems with this thick stiff paper tape. Our problem is the strength of the spring that supports the tape at its pick position. After a while it just pushes it down because the tape exit wants to bend the tape too sharply
Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1
Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di
Electronics Forum | Wed May 07 10:15:46 EDT 2008 | llaerum
We are also having some issues with certain small parts. In our case this is tantalum caps and 0402 caps. We had a vendor admit after much discussion that the plating used from a particular orgin was different on the tantalums. The tehory is thatthsi
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
