Electronics Forum | Fri Oct 13 17:21:05 EDT 2000 | Jason Nipper
A few weeks back we experienced a wave process problem where we received deposits on our pcb. At first we though it was dedrites but after an outside analysis of the deposits they were found to be tin. We have tried to remove the deposits with brus
Electronics Forum | Tue Jun 26 16:43:19 EDT 2001 | CPI
Yes a 6 mil solder deposite will reduce to approx 50% of it's original size. Does this happen on only 1 BGA? Is the BGA that its happening on have smaller balls than the others, what I'm getting to is, are you sure you are depositing the proper amo
Electronics Forum | Tue Jun 26 21:41:10 EDT 2007 | davef
4.4 Determine the amount of flux on the board. 4.4.1 Get a piece of corrugated cardboard and a weighing scale accurate to 0.01 grams. NOTE: Use cardboard with alcohol fluxes to slow their evaporation and get good data. 4.4.2 Weigh the cardboard. 4.4
Electronics Forum | Tue Oct 21 11:42:04 EDT 2008 | arosario
Hi Shooter, we're not using AOI but we do every 30 minutes sampling Inspection on the board and we're not seeing insufficient paste deposit so far since we started. But I agree with you that seemed my printer is not printing consistent amount of pa
Electronics Forum | Fri Mar 13 17:09:49 EDT 2009 | kmorris
We have found very small solder deposits on the gold fingers of some PCI boards after assembly at our CM. In the IPC-A-610, it says that no contamination or solder is allowed in the critical contact area. 1. I'm looking for feedback on what others
Electronics Forum | Fri Oct 11 03:06:00 EDT 2019 | bukas
Hello Dekhead, it is a constant offset, like 0.5 mm to right when machine prints away from operator. When print goes towards the operator there is no offset. I swapped X5 and X6 cards with spares I got but still same result . I set the program to hav
Electronics Forum | Fri Aug 10 13:15:35 EDT 2001 | jhingtgen
John, Instead of dispensing the adhesive, why not screen print the adhesive on the PCB? The deposition is very repeatable and accurate.
Electronics Forum | Thu Apr 11 04:03:28 EDT 2002 | mwoodall
The Alpha metals Hi Check 500 is used to measure paste deposit thickness. The paste height is found from a micrometer reading determined by focussing a beam of light on a track adjacent to a paste deposit and then onto the solder paste. I've measure
Electronics Forum | Tue Apr 16 06:29:16 EDT 2002 | Matt Kehoe
Have you considered Solid Solder Deposition? www.sipad.net mk
Electronics Forum | Thu Aug 01 06:25:13 EDT 2002 | matherat
Try solid solder deposit. www.sipad.com
