Electronics Forum | Wed Jul 25 13:05:59 EDT 2007 | ck_the_flip
Here is a good article: http://www.emasiamag.com/article-669-stencildesignforleadfreesmtassembly-Asia.html
Electronics Forum | Fri Sep 18 01:34:58 EDT 2020 | SMTA-64386317
Thank you for your input.
Electronics Forum | Thu Feb 12 21:06:20 EST 2004 | davef
"LGA" [land grid array] is a pretty broad topic. Search the fine SMTnet Archives for background on: * BGA * uBGA * Flip chip * etc Consider: * Area Array Packaging Handbook: Manufacturing and Assembly; Ken Gilleo; McGraw-Hill Professional; 1st edit
Electronics Forum | Sat Dec 16 09:42:41 EST 2006 | Frank
Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefo
Electronics Forum | Tue Feb 17 11:36:33 EST 2004 | POC
Try Amkor web page here http://www.amkor.com/products/notes_papers/appnotes_LGA_0902.pdf Regards POC
Electronics Forum | Mon Feb 29 23:41:09 EST 2016 | padawanlinuxero
Is more a guess but, your drawing is missing things, more precise the legends on the edge of the drawing, but for what I can see the diameter of the ball is 0.30 +- 0.05 hope it helps!
Electronics Forum | Thu Sep 17 03:36:47 EDT 2020 | SMTA-64386317
Hi All, Is there any specific control for solder height and volume? Such as 3 mil what will be the height and volume upper and lower limit?
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve
1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg
Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67
Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like
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