Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef
The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu
Electronics Forum | Thu Nov 11 17:53:59 EST 1999 | Jeff Tamagi
I have read in some magazine articles that there is poor signal to noise ratio of RF devices when no-cean solder is used. The frequecies used exceed one Mhz? Is this true?
Electronics Forum | Wed Nov 12 08:50:08 EST 2008 | greene08
I am trying to find a standard for HASL - especially for small pitch devices. Are there better options than HASL for boards with a large amount of small pitch IC's??
Electronics Forum | Thu Aug 26 03:59:46 EDT 1999 | Wolfgang Busko
Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. Going through datasheets wasn�t that helpfull, so does anyone know of a source for that spe
Electronics Forum | Mon Mar 12 09:25:16 EDT 2007 | rgraves
Our internal designers are employing SMT connectors that utilize a �PCB positioning boss� in conjunction with normal gull wing leads. The use of these devices is based on the advertised ability of the boss to prevent �mis-insertions� and assist in �
Electronics Forum | Mon Sep 14 09:30:34 EDT 1998 | Clive Heke
Can anyone point me in the right direction for information on this subject, my understanding is that it is a new technique, not in widespread use yet.
Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani
Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f
Electronics Forum | Mon May 24 04:05:04 EDT 1999 | Charles Stringer
Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the board te
Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
Electronics Forum | Fri Jul 16 10:32:52 EDT 1999 | Upinder Singh
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
