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Strength of Lead-free BGA Spheres in High Speed Loading

Technical Library | 2008-04-08 17:42:27.0

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.

Nihon Superior Co., Ltd.

Lead-free solder alloy:

Electronics Forum | Thu Jul 28 09:23:48 EDT 2005 | fctassembly

300 million boards to date). I also have some reliability data for joints made with these 2 alloys wave soldered and then repaired with both. All of these results look good. The issue we see is mixing SN63 with any of the lead free alloys. Sn63 wave

SMT packages that can solder inverted?

Electronics Forum | Thu Aug 21 21:05:39 EDT 2003 | Tom B

Dan, We, do alot of double reflow. Your right we typically see alot of the standards components, SOT's, SOIC's, Chip stuff. The largest we do with out adding epoxy is some 32pin PLCC's. We have several assemblies were were doing PLCC44's, Sockets

Solder flags

Electronics Forum | Mon Dec 08 02:04:37 EST 2008 | lococost

IPC S-900T AERO states that these flags are usually caused by the the removal of l�d from solder(l�dfree). Acceptability depends on form/casing. e.g: you wouln't want a tin flag hanging out of your cellphone. Thanks for making my mondaymorning mor

Cu dissolution PTH

Electronics Forum | Thu May 25 12:14:07 EDT 2006 | patrickbruneel

Inds, Thanks for the update You can remove the solder with a desoldering pump Do a search and you will find all the different options. Just to be clear on the cu-dissolution Did I understand correctly that you didn't see a difference between the 2 a

attaching thermocouples

Electronics Forum | Wed Aug 16 16:43:47 EDT 2000 | Steve Thomas

O.K., I give up. I am through trying to solder thermocouples on to 20 mil pitch QFPs. Whether it's my lousy technique (fairly likely), the wrong solder (Kester calls it thermocouple solder, and who am I to argue...it's a Sn10Pb88Ag2 alloy) or just

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian

We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon

We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 15:01:05 EDT 1999 | Dave F

We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian

We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a


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