Electronics Forum | Fri Jul 08 10:38:15 EDT 2005 | patrickbruneel
Hi Inds, Don�t forget to give us an update in about 3 months so we can all learn something from real life experience. Common sense tells me that the alloy will be out of balance in 3 to 6 months (depending on volume and board/comp.plating) but I can
Electronics Forum | Wed May 03 15:16:59 EDT 2006 | patrickbruneel
Great to see you have found a solution because now it looks like the component manufacturers will take their share of copper to. Look here http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10308&mc=2 Inds you have an
Electronics Forum | Wed Jul 06 20:33:39 EDT 2005 | davef
Pat In response to your questions: Q1. How did you measure the area reduction (loss of weight or reduction of diameter/thickness)? A1. We measured the starting and ending diameter. Then calculated the area [assuming symmetry]. Q2. How did you tak
Electronics Forum | Tue Jul 05 17:16:01 EDT 2005 | davef
We agree with Pat, but it's far from straight forward. [er maybe we should say we don't understand it.] We duplicated the results of a posting on the web. Flux, then dunk copper wire into tinning pots set at 250*C for measured periods of time. The
Electronics Forum | Wed Jul 06 13:06:22 EDT 2005 | patrickbruneel
Dave, Great to see you more involved in the lead-free. I assume the tests you have done were in lab environment, would it be possible to explain how you measured the area reduction (loss of weight or reduction of diameter/thickness) and how did you
Electronics Forum | Thu Apr 27 04:21:15 EDT 2006 | slaine
you can either use an alloy that has a higher copper content to reduce dissolution or the better option is to have a Nickel plating barrier. both have there problems. Bu remember the dissolution of copper by tin carries on at a slower rate a ambiant
Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk
Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector
Electronics Forum | Thu Apr 27 08:26:35 EDT 2006 | davef
This is similar to a previous posting here on SMTnet, where, as we recall, one response suggested using a solder alloy with less tin.
Electronics Forum | Mon Nov 14 12:16:54 EST 2005 | Ajay
Hi, I have a lead free solder joint 75micron wide & 3mm in length with copper on either side of solder. Is there any method/relationship between Cu dissolution & Cu weight% so that one can determine how much copper can be present in the solder afte
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
