Electronics Forum: done (Page 2 of 294)

Has anyone done breakaway tabs with v-score on both sides instead of mouse-bites?

Electronics Forum | Wed Jul 26 11:44:55 EDT 2017 | rgduval

Check with your board house and see if they can do jump-scoring. I haven't dealt with a fab house yet that could, though, so, while it should be do-able, it doesn't appear to be super common, IMO. Alternatively, you could sand the edges after break

AOI vs. electrical test

Electronics Forum | Wed Jan 04 09:05:53 EST 2006 | stepheniii

Your process makes a bigger difference. What I have seen is ICT done early is better than AOI done more than a half shift later, and AOI done early is better than ICT done more than a half shift later. For high mix/low volume, I would go with AOI whi

Opportunity

Electronics Forum | Wed Jun 20 11:18:50 EDT 2007 | dboudreau

Hello, I have a question for electronic manufacturers. I would like to know in which cases a solderability test for component leads should be done? Should it be done for all kind of parts or only for those bought from brokers? Also, how often th

Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Thu Sep 10 16:15:52 EDT 1998 | Larry Johnson

I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the B

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Sat Sep 12 20:28:29 EDT 1998 | Rick Bell

| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the

Mass defect criterion

Electronics Forum | Fri Dec 13 04:25:03 EST 2019 | pavel_murtishev

Done.

Archives

Electronics Forum | Thu Jul 12 09:50:52 EDT 2001 | bdoyle

Haha! No it wasn't anything like that, we know what needs to be done, and it will be done soon. So Dave you're reading the Cold Fusion forums now? Jack of all trades! I'll make you a programming geek yet!

BGA Assembly

Electronics Forum | Wed May 29 13:16:33 EDT 2002 | jax

The only reason I can see for doing this is: Apply more paste than a one-to-one round can provide. Square, diamond, etc... does not matter. Normally this is done for PTP applications but,... If it gets the job done, who cares.

piercing of test vias at ICT

Electronics Forum | Thu Nov 14 09:02:46 EST 2002 | MA/NY DDave

Hi Making contact has been one reported problem, so some testers put in higher force probes that then might cause problems. If fixturing is done correctly, the OSP is done correctly, and test follows close in time after soldering little problems s

Vitronics Unitherm 500 and Leadfree

Electronics Forum | Wed Mar 23 12:10:04 EST 2005 | dphilbrick

Has anyone out there done any lead free testing using a Vitronics Unitherm 500 oven? based on the specs I have dug up on the machine I suspect it should work fine but it would be great to hear from someone that has done it. Thanks in advance.


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