Electronics Forum | Tue Feb 04 09:12:40 EST 2003 | davef
Near the top of Phil's front page is thin blue bar with white lettering that extends horizontally across the page. Click on the word "articles" on that blue bar. It will turn a rusty-brown and load another page. On that page, click on the article
Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason
We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?
Electronics Forum | Mon Feb 03 20:23:48 EST 2003 | davef
Use the pad mating to lead wetting area. Check: * Phil Zarrow's site [ http://www.itmconsulting.org ] for a paper. * Bob Willis may have something on his site [ http://www.bobwillis.co.uk ]. He has been very involved in developing this measure. * F
Electronics Forum | Thu Jun 22 14:04:03 EDT 2000 | John Thorup
Hi Jason - I'll second (third?) everything said. Wassink's bible is available in the US from the SMTA bookstore with free shipping. It's pricey but worth every penny. 612/920-7682 www.smta.org email@example.com John Thorup
Electronics Forum | Wed Jun 14 11:22:49 EDT 2000 | Michael Parker
Sachi- To interpret "WASSUP" into something meaningful, you will find all of your questions for Dave by first reading all that you can in this forums archives. Dave is very knowledgable and will mentor you but I suggest you prepare yourself with goo
Electronics Forum | Tue Feb 04 08:20:18 EST 2003 | roertner
This rule is very conservative depending on the epoxy you use and the subsequent handling of the board prior to reflow. You should use lead to pad contact area. Also be sure to look at part height and clearance on your flowsolder machine.
Electronics Forum | Mon Feb 03 18:37:28 EST 2003 | jonfox
Not to be off-topic, but push engineering for embedded passives and remove parts from the underside all together. Watch the material cost sky rocket, but watch the manufacturing cost sink and well as improve the production cycle by 50%. Sorry, I w
Electronics Forum | Mon Feb 03 18:00:49 EST 2003 | slthomas
I know that the accepted (by some, although some say it may be too conservative) rule is anything less than or equal to 30 grams/square inch of surface contact area should stay on the bottom side during the second pass. How is that surface area meas
Electronics Forum | Thu Jun 22 11:01:54 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
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