Electronics Forum | Wed Feb 23 12:42:28 EST 2011 | davef
If we understand correctly, your SMT solder connections remelt when passing through the wave solder machine and your QA-people don't like it when that happens. It's nice not to remelt this solder, but as long as the board meets your acceptance stand
Electronics Forum | Tue Apr 11 17:45:02 EDT 2000 | Ashok Dhawan
I am looking for an appropriate method to dry wave soldered boards. While board assemblies are passed through board cleaning station , they are not fully dry . We do not want to heat above 180 deg F to dry them completely. We think that air drying u
Electronics Forum | Tue Jan 24 03:03:03 EST 2017 | saju86ece
Hi, Stencil thickness is 12mil. I did not able to attach image due to some error.
Electronics Forum | Wed Feb 15 01:49:34 EST 2017 | soldertraining
Hi I completely agree with you. Also, the Dry Solder paste can be used in wireless repair operations such as the repair of smart phones, tablets, laptops and other handheld devices. The lead-free solder paste can be squeegeed through the apertures of
Electronics Forum | Wed Jan 11 09:21:19 EST 2017 | rgduval
Do you have some pictures of the condition that you are facing? Your description of the issue sounds more like dewetting, rather than cold solder. A picture would help us better understand what you're facing. Cheers, ..rob
Electronics Forum | Tue Jan 24 05:33:25 EST 2017 | robertwillis
Did not see any emails from you and the limit is 10megs Why are you using 0.012" how thick is you board or what is t he hole to lead ratio as the thickness is high!!! Bob Willis bob@bobwillis.co.uk
Electronics Forum | Wed Jan 11 11:52:50 EST 2017 | emeto
First, why do you have paste on the opposite side of the component. I would recommend having it on the same side. Second, how thick is your stencil? Pin in paste requires thickness, to fill the whole barrel. Stencil should be really thick. Try to man
Electronics Forum | Sun Jan 22 04:57:25 EST 2017 | robertwillis
If you look at my book on Pin In Hole Reflow there are many examples of may process defects. Its free to download and the first book on the technology. if you send a photo of the defect I may be able to point you in the right direction see http://pih
Electronics Forum | Mon Jan 09 23:24:47 EST 2017 | saju86ece
Hi, We are doing pin in paste reflow process in one our product ( but paste printed on bottom side of the board and top side will be assembled through hole component)in which faced cold solder issue in THT capacitor location after reflow. The solder
Electronics Forum | Wed Dec 09 09:47:32 EST 2009 | dyoungquist
I am curious as to why you need to mix.... We use a 500g cartridge with air gun. Our process is remove the cartridge from the fridge, allow it to warm up to room temperature before inserting into air gun, then apply bead of paste to the stencil. N
.gif)
