Electronics Forum | Tue Nov 08 17:12:10 EST 2005 | Erik
I haven't heard of heating boards pre-depanel either. We have done extensive studies on cracking of ceramic caps close to V-scored edges and have decided to have our board vendors pre-rout any areas with caps close (
Electronics Forum | Tue Oct 08 10:16:39 EDT 2019 | leeg
We used a similar part and adjusted the routing so that the front edge of the connector was supported and therefore keeping the connector flat and it not being able to tip forward. I don't know if this is something that you can do with your board?
Electronics Forum | Tue Jun 03 16:05:58 EDT 2003 | mk
Hi Randy, From a bare board manufacturers stand point, scoring is probably faster and easier but has limitations. If your boards are square or rectangle scoring will work fine. Once assembled the scored grooves can be sliced apart using what is some
Electronics Forum | Mon Nov 08 11:01:12 EST 1999 | Brian Larson
We are leaving 12-18 thousands material when scoring. Several components are cracking during depanelization. The pizza cutter machines out there are either too expensive or too slow to solve our problem. I am looking for a magical solution. In case
Electronics Forum | Mon Jun 22 21:31:43 EDT 1998 | Dave F
| Dear collegues, | I like to have your comments/ experience with various methods of depanelization like routing, scoring, cutting etc. | Any feed back on the equipment used with company addresses will be highly appreciated. | Please identify if pos
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
Electronics Forum | Tue Sep 07 12:02:30 EDT 1999 | Brad Kendall
| Dear sirs, | | If you have experienced Proflow of DEK screen printer, please let me know the details of it. | | Best regards, | | Jame Bond | | I have had Proflow for about 8 weeks now. I have had my fair share of problems with it. It does
Electronics Forum | Fri May 11 17:21:04 EDT 2001 | davef
Three main groups of depaneling equipment are: 1 Scoring: Limited to straight edges and mainly 90� angles 2 Routing: And a cloud of dust 3 Singulating: Hard tooled by board To get started understanding the suppliers look here: http://www.cassembly.c
