Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.
Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an
Electronics Forum | Tue Apr 11 09:45:45 EDT 2000 | emmanuel
Hi Kc, As recommended by the PBGA supplier, the temperature of the package surface should not exceed 225�C during 10 seconds max so as to avoid popcorn effect. Given that some of products reflow profils are specifiing reflow temperature at 250�C,
Electronics Forum | Fri Jan 07 10:27:07 EST 2011 | patrickbruneel
Hi, Detergent/saponifiers have indeed the potential to tarnish aluminum. This is due to the high alkalinity of the chemistry (pH 10-12). Things you can do to minimize the effect is: A) Limit the exposure time of the Al with the chemistry. B) Reduc
Electronics Forum | Mon Apr 16 20:53:56 EDT 2007 | davef
Tell us about: * Temperatures and times of the thermal profile * Where the thermocouples were mounted * Materials involved * Where in the process the 672 BGA component is soldered * Processes that follow that soldering
Electronics Forum | Thu Jan 06 23:07:48 EST 2011 | essohn
Hello~ I need your expoertised experience. Do you have any experience of Saponifier influence on Al pad for wire bonding. We have a porblem of no wire bonding in use of saponifier in order to remove clean type flux. thanks in advance
Electronics Forum | Sun Jan 09 19:08:18 EST 2011 | essohn
Hi Patrick, Thank you so much for your good advice. I will follow your guideline. Thank you again.
Electronics Forum | Sun Jan 09 23:21:54 EST 2011 | essohn
Hello Patrick, thank syou for your good advice and guideline. I will trto followup your suggestion. Thanks again.
Electronics Forum | Fri Apr 13 09:41:41 EDT 2007 | aj
All, I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works. Clearly there is an issue with the wetting of some Balls causing a poor connection. My profile looks spot on - I think I poste
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
Electronics Forum | Mon Aug 16 05:42:53 EDT 1999 | Omat Marasigan
Hello reflow experts, I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. thanks in advance.... ...Omat
